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| General description | ||||
| Bis-phenol modified epoxy resins are polymeric resins obtained byreacting of phenols and liquid epoxy resin. Its flexible structures canimprove the toughness and impact resistance of regular epoxy networks, and the larger molecular structures can also bring in good film-forming ability and improve the fluidity in copper cladding process,as in the applications of copper clad laminates. |
| Physico-Chemical Data | ||||
| Item | Unit | TER220A80 | TER288K70 | |
| Description | BPA chain extender epoxy resin solution | BPFchain extender epoxy resin solution | ||
| Appearance | colorless to light yellow liquid | light yellow clear liquid | ||
| Solid content(N.V.) | % | 79-81 | 69-71 | |
| Hy-Cl | ppm | 0-500 | 0-500 | |
| Viscosity(Brookfield) | mPa.s/25℃ | 3000-8000 | 500-3000 | |
| Color | G | 0-3 | 0-8 | |
| Storage conditions | ||||
| Store inadry and cool condition environment,avoiding direct sunlight. | ||||
| Package | ||||
| Iron bucket 220kg/barrel. Ton barrel 1100kg/barrel。 |
| Application field | ||||
| 1. CCL&PCB | ||||
| 2. Printing ink | ||||
| 3. Coatings | ||||
| 4. Adhesive |
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