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General description | |||||
DOPO modified epoxy resin is a high performance resin with good flameretardancy by modifying epoxy resin with DOPO and its derivatives.Because of its good thermal resistance, high glass transitiontemperature, low water absorption and low CTE, the series of resins canbe widely used in the field of halogen-free copper clad laminate. |
Physico-Chemical Data | |||||
Item | Unit | TER530K75 | TER620K70 | TER680K75 | TER685K75 |
Description | DOPO modified epoxy resin solution | DOPO-HQ modified epoxy resin solution | DOPO-NQ modified epoxy resin solution | DOPO-NQ modified epoxy resin solution | |
Appearance | transparent liquid | brown clear liquid | brown clear liquid | brown clear liquid | |
EEW | g/eq | 260-320 | 300-340 | 290-340 | 300-360 |
Solid content(N.V.) | % | 74-76 | 69-71 | 74-76 | 74-76 |
Viscosity(Brookfield) | mPa.s/25℃ | 200-2000 | 100-1000 | 500-5000 | 0-5000 |
Hy-Cl | ppm | 0-500 | 0-300 | 0-500 | 0-300 |
Color | G | 0-3 | 5-11 | 8-14 | 8-12 |
P content(wt) | % | 2.5-3.5 | 1.5-2.5 | 1.5-2.5 | 2.0-3.0 |
Storage conditions | |||||
Store inadry and cool condition environment,avoiding direct sunlight. | |||||
Package | |||||
Iron bucket 220kg/barrel. |
Application field | |||||
1. CCL&PCB | |||||
2. Compositematerial | |||||
3. Printing ink | |||||
4. Adhesive |
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